Development and application of a multipurpose electrodeposition cell configuration for studying plating processes on wafer specimen and for characterizing surface films by scanning electrochemical microscopy

Hanekamp, Patrick and Robl, Werner and Matysik, Frank-Michael (2017) Development and application of a multipurpose electrodeposition cell configuration for studying plating processes on wafer specimen and for characterizing surface films by scanning electrochemical microscopy. JOURNAL OF APPLIED ELECTROCHEMISTRY, 47 (12). pp. 1305-1312. ISSN 0021-891X, 1572-8838

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Abstract

In this report, a versatile experimental concept for electrochemical deposition and subsequent surface characterization studies is presented. This concept can be utilized to perform semiconductor plating processes at laboratory scale followed by scanning electrochemical microscopy (SECM). The same sample holder used for electroplating experiments could be integrated into the SECM instrument. Conductive thin-film barrier materials were deposited on planar silicon wafers. The substrate samples were fixed in the multipurpose sample holder ensuring a large electrical contact area to minimize ohmic drop across the sample surface with a small circular area of the substrate material of 16 mm(2) exposed to electrolyte solution. In order to investigate the capabilities of the electrochemical cell configuration, a potentiostatic copper deposition on ruthenium was carried out. Thus, information on film coalescences, grain size, and growth mode could be derived. SECM was used to study the effect of biasing during probe approach curves on a titanium surface. Furthermore, microstructured copper layers were imaged using ferrocenemethanol (FcMeOH) as mediator. The results show that biasing the substrate is essential for non-destructive and interaction-free measurements of semiprecious thin-film materials and copper structures, if FcMeOH is used as electrochemical mediator.

Item Type: Article
Uncontrolled Keywords: DIRECT COPPER ELECTRODEPOSITION; DIFFUSION BARRIER; LINER MATERIALS; NUCLEATION; SECM; CU; INTERCONNECTS; DEPOSITION; CORROSION; GROWTH; Scanning electrochemical microscopy; Electrodeposition; Copper; Nucleation; Semiprecious thin-film material
Subjects: 500 Science > 540 Chemistry & allied sciences
Divisions: Chemistry and Pharmacy > Institut für Analytische Chemie, Chemo- und Biosensorik
Chemistry and Pharmacy > Institut für Analytische Chemie, Chemo- und Biosensorik > Instrumentelle Analytik (Prof. Frank-Michael Matysik)
Depositing User: Dr. Gernot Deinzer
Date Deposited: 14 Dec 2018 13:19
Last Modified: 19 Feb 2019 07:49
URI: https://pred.uni-regensburg.de/id/eprint/1804

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