Etschmaier, A. and Mori, G. and Wieser, H. and Wegscheider, Werner (2002) On the mechanism of solders during the M-effect. MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK, 33 (2). pp. 90-98. ISSN 0933-5137
Full text not available from this repository.Abstract
Slaggish switching-off behaviour of HBC-fusions (M-effect) is ensured by a solder droplet on the copper fusion conductor, First the function of currently used toxic SnCd20 solder was investigated by melting, switching off and annealing tests. With these results the mechanism of the "M-effect" was described and further tests were made with alternative alloys tin-bismuth, tin-indium and ternary alloys tin-bismuth-copper and tin-indium-copper. The ternary system tin-bismuth-copper was found to give best results and showed the same time-temperature-dissolution-behaviour during the M-effect as the SnCd20 solder. Function of different solders and necessary properties are discussed.
| Item Type: | Article |
|---|---|
| Uncontrolled Keywords: | COUPLES; |
| Subjects: | 500 Science > 530 Physics |
| Divisions: | Physics > Institute of Experimental and Applied Physics > Alumni or Retired Professors > Group Werner Wegscheider |
| Depositing User: | Dr. Gernot Deinzer |
| Date Deposited: | 15 Nov 2021 07:15 |
| Last Modified: | 15 Nov 2021 07:15 |
| URI: | https://pred.uni-regensburg.de/id/eprint/40643 |
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